EP1S80F1508C7 vs EP1S80F1508C6 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1S80F1508C7 sa pamamagitan ng Intel at EP1S80F1508C6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP1S80F1508C7 - Stratix 80K LEs, 1203 I/O FPGA BGA-1508 | Intel
EP1S80F1508C7 ⚠ Huling Pagbili
Pagsanggunian na paghahambing
| Parametro | EP1S80F1508C7 | EP1S80F1508C6 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Family | Stratix | Stratix |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements (LE) | 79,040 | — |
| Total LABs/CLBs | 7,904 | — |
| Total Memory Bits | 7,427,520 | — |
| Number of I/O | 1203 | — |
| DSP Blocks | 28 | — |
| Embedded Multipliers (9x9) | 224 | — |
| Process Technology | 0.13 um, all-layer copper SRAM | 0.13 µm all-layer copper SRAM |
| Core Voltage | 1.5 V | 1.5 V |
| Speed Grade | C7 | — |
| Temperature na Operasyon | 0C to +85C (Commercial) | — |
| Packhaging | 1508-BBGA, FCBGA | 1508-ball FC-FBGA |
| Package Body Size | 33 x 33 mm | 33 mm x 33 mm |
| Ball Pitch | 1.0 mm | — |
| Uri ng Pagpapasok | Surface Mount (Flip-Chip BGA) | — |
| Configuration Memory | SRAM (volatile, requires external config device) | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Tindminan RoHS | Compliant (lead-free) | Compliant per distributor listings |
| Logic Elements (LEs) | — | 79,040 |
| Logic Array Blocks (LABs) | — | 7,904 |
| Total RAM Bits | — | 7,427,520 |
| Maximum User I/O | — | 1,203 |
| Maximum Internal Frequency | — | 450.05 MHz |
| Operating Temperature Grade | — | Commercial (0C to 85C) |
| Package Pitch | — | 1.0 mm |
| Embedded DSP Blocks | — | 12 (9-bit x 9-bit multipliers) |
| PLLs | — | Multiple (per datasheet) |
| Embedded Memory Architecture | — | TriMatrix (M512, M4K, M-RAM) |