EP1SGX10DF672I6 vs EP1SGX10DF672C5N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP1SGX10DF672I6 sa pamamagitan ng Intel at EP1SGX10DF672C5N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP1SGX10DF672C5N - Stratix GX FPGA, 10,570 Cells, 672-BGA | Intel
EP1SGX10DF672C5N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP1SGX10DF672I6 | EP1SGX10DF672C5N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Family | Stratix GX | Stratix GX |
| Logic Elements (LEs) | 10,570 | — |
| Embedded RAM | 920,448 bits | — |
| Embedded Multipliers | Yes (DSP blocks) | — |
| Transceiver Channels | 12 (3.125 Gbps) | — |
| Maximum User I/O | 362 | — |
| PLLs | 4 | — |
| Process Technology | 130 nm CMOS | — |
| Core Supply Voltage | 1.5 V | — |
| Temperature na Operasyon | 0 C to +85 C (commercial) | 0 C to 85 C (Commercial) |
| Packhaging | 672-ball FC-FBGA (DF672) | 672-ball FC-FBGA (FineLine BGA), 33 x 33 mm, 1.0 mm pitch |
| Package Body Size | 33 x 33 mm, 1.0 mm pitch | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (Flip-Chip BGA) |
| Level ng MSL | [DATA_NEEDED: MSL Level] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS Status] | Compliant (FBGA package) |
| Logic Cells | — | 10,570 |
| Logic Array Blocks (LABs) | — | 1,057 |
| Configurable Logic Blocks | — | 1,200 |
| User I/Os | — | 362 |
| On-chip RAM | — | 920,448 bits |
| Supply Voltage (Core, VCCINT) | — | 1.5 V nominal (1.425 V to 1.575 V) |
| Technology | — | 130 nm CMOS |
| Logic Family | — | CMOS |
| Configuration | — | Passive Serial / Passive Parallel / JTAG / Altera Serial |
| High-Speed Transceivers | — | Embedded GX transceivers (data rate not specified in provided data [DATA_NEEDED: transceiver count and max data rate]) |