EP20K400EFI672-2X vs EP20K400FI672-1XN Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K400EFI672-2X sa pamamagitan ng Intel at EP20K400FI672-1XN sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP20K400EFI672-2X | EP20K400FI672-1XN |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | APEX 20KE | APEX 20K |
| Series | EP20K400E | — |
| Logic Elements | 16,640 | 16,640 |
| System Gates | 400,000 | — |
| Embedded Memory | 212,992 bits | — |
| Maximum User I/O | 488 | — |
| Number of I/O Banks | 8 | — |
| PLLs | 4 | — |
| Core Voltage (VCCINT) | 1.71 V to 1.89 V (1.8 V nominal) | — |
| Process Technology | 0.22 µm CMOS | 0.18 micrometer CMOS |
| Maximum Internal Frequency | 223 MHz | — |
| Temperature na Operasyon | 0 °C to 85 °C (Industrial) | -40 C to +85 C (industrial) |
| Packhaging | 672-ball FineLine BGA (FC-FBGA), 27 × 27 mm | 672-ball FineLine BGA (FI672) |
| Ball Pitch | 1.27 mm | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | 3 | — |
| Peak Reflow Temperature | 220 °C | — |
| Wala sa Halogen | Compliant | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Device | — | EP20K400 |
| Typical Gates | — | 400,000 |
| Maximum User I/O Pins | — | 488 |
| Embedded System Memory | — | 212 Kbit |
| Number of PLLs | — | 4 |
| Core Supply Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | — | 2.5 V / 3.3 V |
| Package Size | — | 27 mm x 27 mm |
| Configuration Method | — | SRAM, JTAG, EPC serial PROM |
| JTAG Support | — | IEEE 1149.1 boundary-scan compliant |
| Speed Grade | — | -1 |
| Level ng MSL | — | 3 |