EP20K400GI655-3V vs EP20K400GI655-2V Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K400GI655-3V sa pamamagitan ng Intel at EP20K400GI655-2V sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP20K400GI655-3V - APEX 20K 400K-Gate FPGA, 16K LE, 655-Pin PGA | Altera (Intel)
EP20K400GI655-3V ObsoletePagsanggunian na paghahambing
| Parametro | EP20K400GI655-3V | EP20K400GI655-2V |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Series | APEX 20K | — |
| Device Family | EP20K400 | — |
| Logic Elements | 16,640 | 16,640 |
| Typical Gate Count | 400,000 gates | — |
| Maximum User I/O | 496 | — |
| Dedicated Inputs | 6 | 6 |
| Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | — |
| Total Embedded RAM | [DATA_NEEDED: total RAM bits] | — |
| Technology | CMOS (0.18 µm process) | — |
| Maximum Internal Clock Frequency | 714.2 MHz | — |
| Supply Voltage VCCINT | 2.5 V | — |
| I/O Supply Voltage VCCIO | 2.5 V or 3.3 V | — |
| Packhaging | 655-pin SPGA (Staggered PGA), 47 x 47 mm | SPGA-655 (ceramic, 47 x 47 mm) |
| Uri ng Pagpapasok | Through-Hole (Pin Grid Array) | — |
| Temperature na Operasyon | -40 °C to +85 °C (industrial) | Industrial (per -2V speed grade) |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | 1 | 1 |
| Qualification | Not Qualified | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Non-compliant (ceramic SPGA, contains lead) |
| Configuration Interface | IEEE 1149.1 JTAG + serial / parallel passive | — |
| Family | — | APEX 20K |
| Maximum Gates | — | 400,000 |
| Embedded RAM Bits | — | 212,992 |
| User I/O Pins | — | 496 |
| Package Equivalence Code | — | SPGA655,47X47 |
| Process Technology | — | 0.18 µm CMOS |
| Core Supply Voltage | — | 2.5 V (2.375 V to 2.625 V) |
| I/O Supply Voltage | — | 3.3 V |
| Propagation Delay | — | 3.0 ns to 3.1 ns |
| Package Body Material | — | Ceramic |