EP20K600CF672-3X vs EP20K600CF672 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K600CF672-3X sa pamamagitan ng Intel at EP20K600CF672 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP20K600CF672-3X - 600K Gate APEX 20KC FPGA, F672, -3X Speed | Intel / Altera
EP20K600CF672-3X ObsoleteIntel
EP20K600CF672 - 600K APEX 20KC FPGA, 672-BGA | Intel
EP20K600CF672 [data_needed: lifecycle status]Pagsanggunian na paghahambing
| Parametro | EP20K600CF672-3X | EP20K600CF672 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | [DATA NEEDED: Lifecycle Status] |
| Series | APEX 20KC | — |
| Family | APEX 20K (MultiCore) | — |
| Typical Gates | 600,000 | — |
| Logic Elements | 24,480 | [DATA_NEEDED: logic element count] |
| Maximum System Gates | 1,537,000 | — |
| Embedded System Blocks (ESBs) | 312 | — |
| Maximum RAM Bits | 311,296 | — |
| Maximum User I/O Pins | 508 | — |
| PLLs | 4 | — |
| Packhaging | 672-pin FineLine BGA (F672) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Speed Grade | -3X (fastest) | — |
| Temperature na Operasyon | 0C to +85C (commercial) | 0 C to 85 C for supplied EP20K600CF672C9N/C8N references |
| Process Technology | 0.18 um CMOS, SRAM-based | 0.15 um all-layer copper-metal process for supplied family references |
| Configuration Method | SRAM, serial/parallel, EPC support | — |
| Tindminan RoHS | [DATA_NEEDED: rohs status] | unknown |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Product Type | — | Field-Programmable Gate Array (FPGA) |
| Product Family | — | APEX-20KC |
| Manufacturer | — | Altera / Intel |
| User I/O Lines | — | 508 I/O |
| Propagation Delay | — | 1.48 ns for supplied EP20K600CF672C9N/C8N references |
| Device Type Listed by Supplied References | — | SPLD |
| Performance Claim | — | Up to 35% faster than APEX 20KE devices |
| Package Type | — | 672-ball BGA, FCBGA |
| Package Dimensions | — | 45 mm x 45 mm |
| Ball Pitch | — | 1.27 mm |
| Configuration Device Type | — | Enhanced Configuration (EPC) device |
| Core Voltage | — | [DATA_NEEDED: core supply voltage] |
| I/O Voltage | — | [DATA_NEEDED: I/O supply voltage] |
| Configuration Memory | — | [DATA_NEEDED: configuration memory type and capacity] |
| Embedded Memory | — | [DATA_NEEDED: embedded memory capacity] |
| REACH Status | — | unknown |
| AEC-Q100 Status | — | unknown |