EP20K600CF672C8N vs EP20K600CF672C8 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K600CF672C8N sa pamamagitan ng Intel at EP20K600CF672C8 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP20K600CF672C8N | EP20K600CF672C8 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Unknown |
| Device Type | SPLD | Field Programmable Gate Array (FPGA) |
| Product Type | FPGA / programmable logic device | — |
| Family | APEX 20KC | — |
| Nominal Gate Capacity | 600K gates | — |
| Logic Elements or Cells | 24,320 | — |
| Macros | 2,432 | — |
| User I/O Count | 508 | 508 |
| Package Terminals | 652 pins | — |
| Packhaging | BGA-652, 45 x 45 mm, 1.27 mm pitch | — |
| Package Description | 672-pin FC-FBGA | — |
| Volte ng Pagbibigay | 1.8 V | 1.71 V to 1.89 V |
| Listed Frequency | 301.21 MHz | — |
| Propagation Delay | 1.48 ns | 1.48 ns |
| Fabrication Process | 0.15 µm | 0.15 um |
| Temperature na Operasyon | 0°C to 85°C | 0 C to 85 C |
| Interconnect Metal | All-layer copper metal | — |
| I/O Configuration | 508 user I/O | — |
| Uri ng Pagpapasok | Surface mount | Surface Mount |
| Tindminan RoHS | unknown | Non-compliant |
| REACH Status | unknown | — |
| AEC-Q100 Qualification | unknown | — |
| Configuration Method | [DATA_NEEDED: configuration memory and programming method] | — |
| Core Current | [DATA_NEEDED: core supply current] | — |
| I/O Bank Voltage | [DATA_NEEDED: supported I/O voltage range] | — |
| Junction Temperature | [DATA_NEEDED: maximum junction temperature] | — |
| Thermal Resistance | [DATA_NEEDED: junction-to-ambient thermal resistance] | — |
| Product Family | — | APEX-20K |
| Logic Elements | — | 24,320 |
| Total RAM Bits | — | 311,296 bits |
| Package Pin Count | — | 672 balls |
| Supplier Device Package | — | 672-FBGA, 27 mm x 27 mm |
| Alternate Package Description | — | BGA-652, 45 mm x 45 mm, 1.27 mm pitch |
| Package Type | — | FBGA |
| Lead-Free Status | — | [DATA_NEEDED: lead-free status] |
| Configuration Interface | — | [DATA_NEEDED: configuration interface] |
| Maximum Core Frequency | — | [DATA_NEEDED: maximum core frequency] |