EP20K60EFC144-2XN vs EP20K60ETC144-1X Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP20K60EFC144-2XN sa pamamagitan ng Altera at EP20K60ETC144-1X sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP20K60EFC144-2XN - APEX-20KE FPGA 60K Gates 93 I/O 144-BGA | Intel/Altera
EP20K60EFC144-2XN NrndIntel
EP20K60ETC144-1X - 60K-Gate APEX-20KE FPGA, 144-LQFP | Intel/Altera
EP20K60ETC144-1X ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP20K60EFC144-2XN | EP20K60ETC144-1X |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Huling Pagbili |
| Series | APEX-20KE | APEX-20KE |
| Family | APEX-20K (MultiCore Architecture) | — |
| Typical Gate Count | 60,000 gates | — |
| Logic Elements / Embedded Array Blocks | 2,560 | — |
| Embedded Memory (Bits) | 32,768 | — |
| Maximum User I/O | 93 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Core Supply Voltage (VCCINT) | 1.71 V to 1.89 V | — |
| I/O Supply Voltage (VCCIO) | [DATA_NEEDED: VCCIO range] | — |
| Package Type | 144-BGA (Fine-pitch Ball Grid Array) | — |
| Package Code (per MPN suffix) | FBGA / LBGA, 13x13 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Operating Temperature (TJ) | 0 C to +85 C (commercial) | — |
| Speed Grade | -2 (per MPN suffix) | — |
| Configuration Method | JTAG (IEEE 1149.1), Passive Serial, Parallel | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS status] |
| Logic Family | CMOS, SRAM-based LUT | CMOS |
| Logic Elements / Cells | — | 2,560 |
| Total Gates | — | 60,000 |
| Total RAM Bits | — | 32,768 |
| Number of I/O | — | 92 |
| Number of Logic Elements/Cells | — | 2,560 |
| Core Voltage | — | 1.8 V (1.71 V to 1.89 V) |
| Propagation Delay | — | 1.72 ns |
| Internal Frequency (Max) | — | 160 MHz |
| Temperature na Operasyon | — | 0 C to +85 C |
| Process Technology | — | 0.22 um CMOS |
| Packhaging / Kaso | — | 144-LQFP |
| Supplier Device Package | — | 144-TQFP (20x20 mm) |
| Terminal Pitch | — | 0.5 mm |
| Lead Finish / Terminal Form | — | Gull Wing (LQFP) |
| Architecture | — | MultiCore (SOPC) |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |