EP2A25F672C9N vs EP2A25F672I8N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25F672C9N sa pamamagitan ng Intel at EP2A25F672I8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2A25F672C9N EP2A25F672I8N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Huling Pagbili
Family APEX II APEX II
Logic Elements / Cells 24320 —
System Gates Approx. 900000 —
Maximum User I/O 492 —
Operating Frequency 236 MHz —
Core Supply Voltage (VCCINT) 1.425 V to 1.575 V (nominal 1.5 V) —
Process Technology 0.15 µm all-layer copper, up to 8 metal layers 0.15 µm all-layer copper-metal
Packhaging 672-ball FineLine BGA (F672), 27 × 27 mm, 1.00 mm pitch 672-ball FC-FBGA (FineLine BGA)
Uri ng Pagpapasok Surface Mount (BGA) —
Seated Height (max) 2.100 mm —
Propagation Delay 2.23 ns 1.69 ns
Logic Family CMOS CMOS
Temperature na Operasyon 0 °C to +85 °C (commercial, C9 grade) 0 °C to 85 °C
I/O Standards Supported LVTTL, LVCMOS, PCI, GTL+, SSTL-2/3, LVDS, LVPECL, PCML, HyperTransport True-LVDS, LVPECL, PCML, HyperTransport
LVDS Data Rate Up to 1 Gbps (True-LVDS) —
Configuration Interface Serial / Parallel PROM, JTAG, passive parallel (enhanced) —
Embedded Memory Enhanced System Blocks (ESBs) for dual-port RAM —
Design Software Quartus II (v5.1 or later) —
Tindminan RoHS Compliant (per distributor listings) unknown
Device — EP2A25
Logic Elements — 24,320
Gates — 900,000
Embedded Memory (bits) — 622,592
User I/Os — 492
Package Size — 27 x 27 mm
Ball Pitch — 1 mm
Metal Layers — Up to 8
Core Voltage (VCCINT) — 1.5 V
Internal Frequency (max) — 333 MHz
Configuration Method — SRAM-based (Altera Quartus II)
Lead-Free — unknown

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