EP2A25F672I6 vs EP2A25F672I7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25F672I6 sa pamamagitan ng Intel at EP2A25F672I7N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A25F672I6 | EP2A25F672I7N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Family | APEX II | APEX II |
| Logic Elements (typical gates) | 25,000 | — |
| Fabric Architecture | SRAM-based LUT | — |
| Process Technology | 0.18 µm CMOS | 0.15 µm CMOS |
| Packhaging | 672-ball FineLine BGA (FBGA-672) | 672-ball FC-FBGA |
| Core Voltage | 1.5 V | — |
| Configuration Method | External SRAM configuration device (EPC series) | — |
| Temperature Grade | Industrial (-40 °C to +100 °C ambient) | — |
| Speed Grade | 6 | 7 |
| Embedded Memory | Embedded System Blocks (ESB), dual-port RAM / CAM | — |
| DSP Blocks | MultiCore dedicated multipliers | — |
| Boundary Scan | JTAG (IEEE 1149.1) compliant | — |
| Clock Management | Dedicated PLL / clock tree circuitry | — |
| I/O Bank Count | [DATA_NEEDED: number of user I/O banks] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Level ng MSL | [DATA_NEEDED: moisture sensitivity level] | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Logic Elements (Cells) | — | 24,320 |
| Typical Gate Count | — | 900,000 |
| Maximum Internal Frequency | — | 500 MHz |
| Core Supply Voltage | — | 1.5 V |
| Pin/Ball Count | — | 672 |
| Operating Temperature Grade | — | Industrial (I) |
| Configuration Interface | — | JTAG (IEEE 1149.1), Passive Serial, Fast Passive Parallel |
| Design Software | — | Quartus II |
| Katayuan ng Lifecycle | — | Not Recommended for New Designs (NRND) |