EP2A25F672I8 vs EP2A25F672I6 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2A25F672I8 sa pamamagitan ng Altera at EP2A25F672I6 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2A25F672I8 EP2A25F672I6
Brand Altera Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete NRND
Family APEX II APEX II
Logic Elements / Cells 24,320 —
Equivalent Gates 900,000 —
Embedded Memory (RAM bits) 622,592 —
User I/Os 492 —
Number of PLLs 4 —
Process Technology 0.15 µm CMOS, up to 8 metal layers 0.18 µm CMOS
Core Supply Voltage 1.5 V —
Propagation Delay 1.69 ns (typical) —
Internal Performance 333 MHz (per legacy datasheet) —
LVDS / High-Speed I/O Yes, up to 1 Gbps —
Packhaging 672-ball FC-FBGA (FineLine BGA), 27 × 27 mm, 1 mm pitch 672-ball FineLine BGA (FBGA-672)
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (BGA)
Temperature na Operasyon –40 °C to +85 °C (industrial, 'I' grade) —
Speed Grade I8 (industrial, 8-speed-grade per APEX II ordering scheme) 6
JTAG / Boundary Scan IEEE 1149.1 compliant —
I/O Standards Supported LVTTL, LVCMOS, SSTL, HSTL, LVDS, LVPECL, GTL+, PCI —
Tindminan RoHS unknown [DATA_NEEDED: RoHS compliance status]
Lead-Free Status unknown —
Logic Elements (typical gates) — 25,000
Fabric Architecture — SRAM-based LUT
Core Voltage — 1.5 V
Configuration Method — External SRAM configuration device (EPC series)
Temperature Grade — Industrial (-40 °C to +100 °C ambient)
Embedded Memory — Embedded System Blocks (ESB), dual-port RAM / CAM
DSP Blocks — MultiCore dedicated multipliers
Boundary Scan — JTAG (IEEE 1149.1) compliant
Clock Management — Dedicated PLL / clock tree circuitry
I/O Bank Count — [DATA_NEEDED: number of user I/O banks]
Lead-Free — [DATA_NEEDED: lead-free status]
Level ng MSL — [DATA_NEEDED: moisture sensitivity level]

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