EP2A40F672C8N vs EP2A40F672I7 Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2A40F672C8N sa pamamagitan ng Intel at EP2A40F672I7 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2A40F672C8N EP2A40F672I7
Brand Intel Altera
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Family APEX II APEX II
Series EP2A40 —
Logic Family CMOS —
System Gates 1.5 M —
Logic Elements / Cells 38,400 —
Maximum Operating Frequency 376 MHz —
Propagation Delay 1.55 ns —
Technology Node 0.15 µm —
Process Feature All-layer copper, up to 8 metal layers —
Nominal Supply Voltage (VCCINT) 1.5 V —
Supply Voltage Range 1.425 V to 1.575 V —
User I/Os 492 —
Number of Pins / Balls 672 —
Package Type FC-FBGA (FineLine BGA) —
Package Dimensions 27 x 27 mm —
Ball Pitch 1.0 mm —
LVDS Data Rate 1 Gbps —
Embedded PLLs 4 —
Programming Interface JTAG (IEEE 1149.1) —
Operating Temperature (Commercial) 0 °C to 85 °C —
Speed Grade C8 -7 (speed grade 7)
Tindminan RoHS [DATA_NEEDED: RoHS status] unknown
Logic Elements — 38,400
Maximum System Gates — 1,500,000
Maximum User I/O — [DATA_NEEDED: max user I/O pins for F672 package]
Core Voltage (VCCINT) — 1.5 V
I/O Voltage (VCCIO) — [DATA_NEEDED: VCCIO supported levels]
Process Technology — 0.15 µm CMOS
Core Frequency (max) — 562 MHz
Temperature na Operasyon — -40 °C to +85 °C (Industrial)
Packhaging — 672-ball FC-FBGA
Package Family — Fine-pitch Chip-scale BGA
Uri ng Pagpapasok — Surface Mount
Level ng Sensitivity sa Asid ng Moisture (MSL) — 3
Peak Reflow Temperature — 220 °C
Configuration Method — JTAG / Passive Serial / Active Serial

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