EP2A40F672C9N vs EP2A40F672I-9 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A40F672C9N sa pamamagitan ng Intel at EP2A40F672I-9 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A40F672C9N | EP2A40F672I-9 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | APEX II | APEX II |
| Device Name | EP2A40 | — |
| System Gates | 1,500,000 | 1,500,000 |
| Logic Elements | 38,400 | 38,400 |
| User I/Os | 492 | — |
| Embedded RAM (ESB) | [DATA_NEEDED: ESB total RAM bits] | — |
| Packhaging | BGA-672 (27 x 27 mm, 1.0 mm pitch) | 672-pin FC-FBGA (Fine-pitch Ball Grid Array) |
| Package Code | FC-FBGA / PBGA672 | — |
| Speed Grade | C9 (~1.55 ns propagation delay) | -9 |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | 0.15 µm CMOS |
| Core Voltage | 1.5 V | — |
| Internal Frequency | 366 MHz | — |
| LVDS Data Rate | 1 Gbps | — |
| Propagation Delay | 1.55 ns | — |
| Temperature na Operasyon | 0 °C to +85 °C (commercial) | -40 °C to +100 °C (Industrial) |
| Uri ng Pagpapasok | Surface Mount | — |
| Logic Family | CMOS (SRAM-based configuration) | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | [DATA_NEEDED: RoHS status] |
| Device | — | EP2A40 |
| Maximum Operating Frequency | — | 366 MHz |
| Core Voltage (VCCINT) | — | 1.5 V |
| I/O Voltage (VCCIO) | — | 1.5 V / 1.8 V / 2.5 V / 3.3 V (banked) |
| True-LVDS Channels | — | Yes (dedicated) |
| Embedded Memory | — | Dual-port RAM, single-port RAM, ROM, CAM (via ESBs) |
| Hot Socketing | — | Supported |
| Configuration Mode | — | Passive serial, passive parallel synchronous, passive parallel asynchronous, JTAG |
| Moisture Sensitivity Level | — | MSL 3 |
| Peak Reflow Temperature | — | 220 °C |