EP2A70B724I-8 vs EP2A70B724C7N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A70B724I-8 sa pamamagitan ng Altera at EP2A70B724C7N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2A70B724I-8 | EP2A70B724C7N |
|---|---|---|
| Brand | Altera | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | APEX II | APEX II (EP2A70) |
| Logic Elements / Cells | 67,200 cells | — |
| System Gates | 3,000,000 | 3,000,000 |
| Maximum Internal Frequency | 281 MHz | 420 MHz |
| Process Technology | 0.15 µm CMOS | — |
| Core Supply Voltage | 1.5 V | 1.5 V nominal |
| I/O Supply Voltage | 3.3 V | MultiVolt (1.5V / 1.8V / 2.5V / 3.3V / 5V tolerant) |
| Bilang ng Pins | 724 | — |
| Package Type | FCBGA (Flip-Chip Ball Grid Array) | — |
| Temperature na Operasyon | -40 °C to +100 °C (Industrial) | 0 °C to +85 °C (Commercial) |
| Peak Reflow Temperature | 220 °C (per JEDEC J-STD-020) | — |
| User I/O Banks | [DATA_NEEDED: user I/O bank count] | — |
| User I/O Pins | [DATA_NEEDED: user I/O pin count] | 536 |
| Embedded System Blocks (ESBs) | [DATA_NEEDED: ESB count] | — |
| Embedded Array Blocks (EABs) | [DATA_NEEDED: EAB count] | — |
| Embedded RAM | [DATA_NEEDED: total bits] | — |
| PLLs | [DATA_NEEDED: PLL count] | — |
| Configuration Method | JTAG / Passive Serial / Passive Parallel | JTAG, Passive Serial (PS), Fast Passive Parallel (FPP) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance] | [DATA_NEEDED: RoHS status] |
| Device Type | — | FPGA (Field Programmable Gate Array) |
| Technology | — | 0.15 µm CMOS |
| Logic Cells / Logic Elements | — | 67,200 |
| Propagation Delay (typ.) | — | 2.17 ns |
| Macrocells (memory blocks reference) | — | 16 |
| Packhaging | — | 724-pin FCBGA (Flip-Chip BGA) |
| Ball Pitch | — | 1.27 mm |
| Seated Height | — | 3.5 mm |
| PLL Count | — | [DATA_NEEDED: PLL count] |
| Embedded Memory | — | Embedded System Blocks (ESBs) - dual-port RAM / ROM / CAM |