EP2A70F1508C9 vs EP2A70F1508C8 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A70F1508C9 sa pamamagitan ng Intel at EP2A70F1508C8 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera
EP2A70F1508C9 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2A70F1508C9 | EP2A70F1508C8 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Series | APEX II | APEX II (EP2A70) |
| Family | APEX II FPGA | — |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements / Cells | 67,200 | — |
| Total RAM Bits | 1,146,880 | — |
| Number of I/O | 1,060 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: number of LABs] | — |
| Number of PLLs | 4 | — |
| Number of Gates | [DATA_NEEDED: typical gate count] | — |
| Voltage - Supply (Core) | 1.425 V to 1.575 V | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Packhaging / Kaso | 1508-BBGA, FCBGA | — |
| Supplier Device Package | 1508-FBGA (40 × 40 mm) | — |
| Temperature na Operasyon | 0 °C to 85 °C | 0 °C to 85 °C (commercial) |
| Speed Grade | C9 | — |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | 0.15 µm all-layer copper, up to 8 metal layers |
| High-Speed I/O Standards | True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport | — |
| Configuration Modes | Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel | — |
| Embedded Multiplier Blocks | Yes | — |
| Embedded Memory Type | Dual-port RAM (ESB) / ROM / FIFO | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Device Family | — | APEX II |
| Logic Elements | — | 67,200 |
| Embedded RAM Bits | — | 1,146,880 |
| User I/O Count | — | 1060 |
| Maximum User I/O Pins | — | 1060 |
| Core Voltage | — | 1.425 V to 1.575 V (1.5 V nominal) |
| Packhaging | — | 1508-BBGA, FCBGA (40 x 40 mm) |
| High-Speed Interface Support | — | 1 Gbps True-LVDS, LVPECL, PCML, HyperTransport |
| Uri ng Memory | — | Embedded dual-port RAM / ROM via ESBs |
| Architecture | — | Embedded array with LABs + ESBs |