EP2A70F1508C9 vs EP2A70F1508I-9 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2A70F1508C9 sa pamamagitan ng Intel at EP2A70F1508I-9 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2A70F1508C9 - APEX II FPGA 67.2K LE 1.5V 1508-FBGA | Intel / Altera
EP2A70F1508C9 ⚠ Huling PagbiliIntel
EP2A70F1508I-9 - APEX II FPGA 70K LE, FBGA-1508 | Altera / Intel
EP2A70F1508I-9 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2A70F1508C9 | EP2A70F1508I-9 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Series | APEX II | — |
| Family | APEX II FPGA | APEX II (EP2A) |
| Manufacturer | Intel (formerly Altera) | — |
| Logic Elements / Cells | 67,200 | — |
| Total RAM Bits | 1,146,880 | — |
| Number of I/O | 1,060 | — |
| Number of Logic Array Blocks (LABs) | [DATA_NEEDED: number of LABs] | — |
| Number of PLLs | 4 | — |
| Number of Gates | [DATA_NEEDED: typical gate count] | — |
| Voltage - Supply (Core) | 1.425 V to 1.575 V | — |
| Uri ng Pagpapasok | Surface Mount | — |
| Packhaging / Kaso | 1508-BBGA, FCBGA | — |
| Supplier Device Package | 1508-FBGA (40 × 40 mm) | — |
| Temperature na Operasyon | 0 °C to 85 °C | -40C to +100C (Industrial, suffix I) |
| Speed Grade | C9 | -9 (fastest APEX II speed grade) |
| Process Technology | 0.15 µm all-layer copper, up to 8 metal layers | 0.18 um CMOS, SRAM-based |
| High-Speed I/O Standards | True-LVDS (1 Gbps), LVPECL, PCML, HyperTransport | — |
| Configuration Modes | Passive Serial, Passive Parallel Sync/Async, Fast Passive Parallel | — |
| Embedded Multiplier Blocks | Yes | — |
| Embedded Memory Type | Dual-port RAM (ESB) / ROM / FIFO | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance per data] |
| Level ng MSL | [DATA_NEEDED: MSL level] | — |
| Device Logic Elements | — | [DATA_NEEDED: exact LE count] |
| Typical Gates | — | 70,000 |
| Maximum User I/O Pins | — | [DATA_NEEDED: maximum user I/O] |
| Maximum User Memory Bits | — | [DATA_NEEDED: embedded RAM bits] |
| Packhaging | — | 1508-ball FBGA (FineLine BGA) |
| Configuration Method | — | SRAM-based, in-system reprogrammable |
| On-chip Memory | — | Embedded System Blocks (ESBs) - dual-port RAM/ROM |
| I/O Standards Supported | — | LVTTL, LVCMOS, PCI, SSTL, HSTL, LVDS, LVPECL |
| Differential I/O | — | True-LVDS capable |
| PLL Count | — | [DATA_NEEDED: PLL count] |
| Level ng Sensitivity sa Asid ng Moisture (MSL) | — | 3 |
| Peak Reflow Temperature | — | 220 C |
| Design Software | — | Quartus II (legacy APEX II support) |