EP2AGX125EF29C4G vs EP2AGX125EF29I5G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX125EF29C4G sa pamamagitan ng Intel at EP2AGX125EF29I5G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX125EF29C4G | EP2AGX125EF29I5G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 118,143 | 118,143 |
| Number of LABs/CLBs | 4,964 | — |
| Total RAM Bits | 8,315,904 | — |
| Number of I/O | 372 | — |
| Number of Transceivers | 8 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Voltage - Supply | 0.9 V (core) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Temperature na Operasyon | 0C to +85C (Commercial) | — |
| Packhaging / Kaso | 780-BBGA, FCBGA (29x29 mm, 1.0 mm pitch) | — |
| Speed Grade | C4 | — |
| Process Technology | 40 nm | 40 nm |
| Maximum Operating Frequency | 500 MHz | — |
| Tindminan RoHS | Compliant (G suffix = Pb-free) | Compliant |
| Embedded Memory Bits | — | 8,315,904 |
| User I/O Pins | — | 372 |
| Packhaging | — | 780-ball FCBGA (Flip-Chip BGA), 29x29 mm |
| Core Voltage (VCCINT) | — | 0.9 V |
| Transceivers (GX) | — | Up to 12 (3.75 Gbps) |
| Operating Temperature Grade | — | Industrial (I5): -40C to +100C |
| DSP Blocks | — | Yes (18x18 hardware multipliers) |
| PLL Count | — | Multiple per device (family-dependent) |
| External Memory Support | — | DDR/DDR2/DDR3, QDR II, RLDRAM II |
| Hard IP Blocks | — | PCI Express Gen1/Gen2 (PIPE), memory controllers |
| Configuration Scheme | — | JTAG, AS, PS, FPP |