EP2AGX125EF29C4G vs EP2AGX190EF29C4G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX125EF29C4G sa pamamagitan ng Intel at EP2AGX190EF29C4G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX125EF29C4G | EP2AGX190EF29C4G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 118,143 | — |
| Number of LABs/CLBs | 4,964 | — |
| Total RAM Bits | 8,315,904 | — |
| Number of I/O | 372 | — |
| Number of Transceivers | 8 | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| Voltage - Supply | 0.9 V (core) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Temperature na Operasyon | 0C to +85C (Commercial) | 0C to +85C (Commercial) |
| Packhaging / Kaso | 780-BBGA, FCBGA (29x29 mm, 1.0 mm pitch) | — |
| Speed Grade | C4 | C4 |
| Process Technology | 40 nm | 40 nm |
| Maximum Operating Frequency | 500 MHz | — |
| Tindminan RoHS | Compliant (G suffix = Pb-free) | Compliant |
| Logic Elements (LEs) | — | 181,165 |
| Embedded Memory (bits) | — | 10,177,536 |
| User I/Os | — | 372 |
| Maximum User I/O Pins | — | 372 |
| Transceiver Channels | — | 8 (up to 6.375 Gbps) |
| Core Voltage | — | 0.9 V |
| Packhaging | — | 780-ball FCBGA, 29 mm |
| Level ng MSL | — | 3 (per JEDEC J-STD-020) |
| Programming Method | — | In-system (via JTAG) and SRAM-based |