EP2AGX125EF29I3G vs EP2AGX125EF29I5G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX125EF29I3G sa pamamagitan ng Intel at EP2AGX125EF29I5G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX125EF29I3G | EP2AGX125EF29I5G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Product Family | Arria II GX | — |
| Programmable Logic | 118143 logic elements | — |
| Programmable Bits | 8315904 bits | — |
| User I/O | 372 I/O | — |
| Package Type | 780-BBGA, FCBGA | — |
| Package Code | HBGA | — |
| Terminal Count | 780 terminals | — |
| Terminal Form | Ball | — |
| Package Shape | Square | — |
| Volte ng Pagbibigay | 0.9 V | — |
| Temperature Grade | Industrial | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Configuration Technology | FPGA programmable logic | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Family | — | Arria II GX |
| Logic Elements | — | 118,143 |
| Embedded Memory Bits | — | 8,315,904 |
| User I/O Pins | — | 372 |
| Packhaging | — | 780-ball FCBGA (Flip-Chip BGA), 29x29 mm |
| Process Technology | — | 40 nm |
| Core Voltage (VCCINT) | — | 0.9 V |
| Transceivers (GX) | — | Up to 12 (3.75 Gbps) |
| Operating Temperature Grade | — | Industrial (I5): -40C to +100C |
| DSP Blocks | — | Yes (18x18 hardware multipliers) |
| PLL Count | — | Multiple per device (family-dependent) |
| External Memory Support | — | DDR/DDR2/DDR3, QDR II, RLDRAM II |
| Hard IP Blocks | — | PCI Express Gen1/Gen2 (PIPE), memory controllers |
| Configuration Scheme | — | JTAG, AS, PS, FPP |