EP2AGX125EF29I3G vs EP2AGX125EF29I5G 比較
詳細並排比較 EP2AGX125EF29I3G 由 Intel 與 EP2AGX125EF29I5G 由 Intel. 比較關鍵規格、電氣參數、封裝、生命週期狀態、價格與供貨情況，以找出最符合您設計需求的元件。
規格比較
| 參數 | EP2AGX125EF29I3G | EP2AGX125EF29I5G |
|---|---|---|
| 品牌 | Intel | Intel |
| 類別 | FPGA & CPLD | FPGA & CPLD |
| 生命週期狀態 | 啟用中 | 啟用中 |
| Device Type | Field Programmable Gate Array (FPGA) | — |
| Product Family | Arria II GX | — |
| Programmable Logic | 118143 logic elements | — |
| Programmable Bits | 8315904 bits | — |
| User I/O | 372 I/O | — |
| Package Type | 780-BBGA, FCBGA | — |
| Package Code | HBGA | — |
| Terminal Count | 780 terminals | — |
| Terminal Form | Ball | — |
| Package Shape | Square | — |
| 供應電壓 | 0.9 V | — |
| Temperature Grade | Industrial | — |
| 安裝類型 | Surface Mount | Surface Mount (BGA) |
| Configuration Technology | FPGA programmable logic | — |
| RoHS 狀態 | [DATA_NEEDED: RoHS status] | Compliant |
| REACH Status | [DATA_NEEDED: REACH status] | — |
| Family | — | Arria II GX |
| Logic Elements | — | 118,143 |
| Embedded Memory Bits | — | 8,315,904 |
| User I/O Pins | — | 372 |
| 封裝 | — | 780-ball FCBGA (Flip-Chip BGA), 29x29 mm |
| Process Technology | — | 40 nm |
| Core Voltage (VCCINT) | — | 0.9 V |
| Transceivers (GX) | — | Up to 12 (3.75 Gbps) |
| Operating Temperature Grade | — | Industrial (I5): -40C to +100C |
| DSP Blocks | — | Yes (18x18 hardware multipliers) |
| PLL Count | — | Multiple per device (family-dependent) |
| External Memory Support | — | DDR/DDR2/DDR3, QDR II, RLDRAM II |
| Hard IP Blocks | — | PCI Express Gen1/Gen2 (PIPE), memory controllers |
| Configuration Scheme | — | JTAG, AS, PS, FPP |