EP2AGX260EF29C5N vs EP2AGX260EF29C5G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX260EF29C5N sa pamamagitan ng Intel at EP2AGX260EF29C5G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX260EF29C5N | EP2AGX260EF29C5G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Arria II GX | — |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 244,188 | 260,000 |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 10,238 Kbit | — |
| Number of LABs/CLBs | 10,260 | — |
| Number of Logic Cells | 244,188 | — |
| Number of I/O | 372 | — |
| Number of Transceivers | 12 | — |
| Transceiver Data Rate | Up to 5 Gbps | — |
| PLL Count | 8 (4 enhanced + 4 fast PLLs) | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Temperature na Operasyon | 0 °C to +85 °C (Commercial) | 0C to 85C (commercial) |
| Package Type | 780-BBGA, FCBGA (Flip-Chip) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Level ng MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED] |
| Tindminan RoHS | Compliant (per DigiKey listing) | — |
| Total Memory Bits | — | 12,038,144 bits |
| Embedded RAM Bits | — | 244,188 bits |
| Number of LABs | — | 10,260 |
| User I/O Count | — | 372 |
| Packhaging | — | 780-ball FBGA (FineLine BGA) |
| Package Code | — | HBGA, 29 mm |
| Speed Grade | — | C5 (commercial -5C to 85C) |
| Process Node | — | 40 nm |
| Supply Voltage - Core | — | [DATA_NEEDED: VCCINT nominal] |
| Transceivers | — | Multi-gigabit transceivers (MGTs), count [DATA_NEEDED] |
| DSP Blocks | — | 18x18 multipliers, count [DATA_NEEDED] |
| Lead-Free / RoHS | — | Yes (G suffix) |