EP2AGX260EF29C5N vs EP2AGX260EF29C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX260EF29C5N sa pamamagitan ng Intel at EP2AGX260EF29C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX260EF29C5N | EP2AGX260EF29C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Series | Arria II GX | Arria II GX |
| Family | Arria II GX | — |
| Logic Elements (LE) | 244,188 | — |
| Adaptive Logic Modules (ALM) | [DATA_NEEDED: ALM count] | — |
| Embedded Memory | 10,238 Kbit | — |
| Number of LABs/CLBs | 10,260 | 10260 |
| Number of Logic Cells | 244,188 | — |
| Number of I/O | 372 | 372 |
| Number of Transceivers | 12 | — |
| Transceiver Data Rate | Up to 5 Gbps | — |
| PLL Count | 8 (4 enhanced + 4 fast PLLs) | — |
| Process Technology | 40 nm | 40 nm CMOS |
| Core Voltage | 0.9 V | — |
| Temperature na Operasyon | 0 °C to +85 °C (Commercial) | 0C to +85C (commercial, C6 speed grade) |
| Package Type | 780-BBGA, FCBGA (Flip-Chip) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Level ng MSL | [DATA_NEEDED: MSL level] | 3 |
| Tindminan RoHS | Compliant (per DigiKey listing) | — |
| Logic Elements | — | 244188 |
| Total Memory Bits | — | 12038144 |
| Voltage - Supply | — | 0.9 V core |
| Packhaging / Kaso | — | 780-BBGA, FCBGA (29 x 29 mm) |
| Lead Free | — | Yes |
| JEDEC Standard | — | MS-034 |
| Maximum Operating Frequency | — | 500 MHz |
| Transceivers | — | Up to 16 GXB channels at 6.375 Gbps |
| Uri ng Memory | — | M9K + MLAB (mixed) |
| Hard IP | — | PCIe Gen2 x1/x2/x4, DDR3 PHY |
| Supplier Device Package | — | 780-FBGA (FC-FBGA) |