EP2AGX260EF29I3G vs EP2AGX260EF29C5G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX260EF29I3G sa pamamagitan ng Intel at EP2AGX260EF29C5G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX260EF29I3G | EP2AGX260EF29C5G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Series | Arria II GX | — |
| Family | Arria II GX | Arria II GX |
| Logic Elements / Cells | 244,188 | — |
| Total RAM Bits | 12,038,144 | — |
| Number of I/O | 372 | — |
| Number of Logic Blocks | [DATA_NEEDED: logic blocks count] | — |
| Number of Gates | [DATA_NEEDED: gate count] | — |
| Process Technology | 40 nm | — |
| Core Voltage | 0.9 V | — |
| Operating Frequency (max) | 500 MHz | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | 0C to 85C (commercial) |
| Packhaging / Kaso | 780-BBGA, FCBGA | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | — |
| Lead Free | [DATA_NEEDED: lead-free status] | — |
| Logic Elements (LE) | — | 260,000 |
| Total Memory Bits | — | 12,038,144 bits |
| Embedded RAM Bits | — | 244,188 bits |
| Number of LABs | — | 10,260 |
| User I/O Count | — | 372 |
| Packhaging | — | 780-ball FBGA (FineLine BGA) |
| Package Code | — | HBGA, 29 mm |
| Speed Grade | — | C5 (commercial -5C to 85C) |
| Process Node | — | 40 nm |
| Supply Voltage - Core | — | [DATA_NEEDED: VCCINT nominal] |
| Transceivers | — | Multi-gigabit transceivers (MGTs), count [DATA_NEEDED] |
| DSP Blocks | — | 18x18 multipliers, count [DATA_NEEDED] |
| Lead-Free / RoHS | — | Yes (G suffix) |
| Level ng MSL | — | [DATA_NEEDED] |