EP2AGX260FF35C5N vs EP2AGX260FF35C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX260FF35C5N sa pamamagitan ng Intel at EP2AGX260FF35C4N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Altera
EP2AGX260FF35C4N - Arria II GX 244K LE FPGA, 612 I/O, FCBGA-1152
EP2AGX260FF35C4N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP2AGX260FF35C5N | EP2AGX260FF35C4N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Device Type | FPGA - Field Programmable Gate Array | — |
| Family | Arria II GX | Arria II GX |
| Logic Elements | 244,188 | — |
| Embedded Memory (bits) | 12,038,144 | — |
| Logic Array Blocks (LABs) | 10,260 | — |
| 18x18 Hardware Multipliers | 736 | — |
| User I/O Count | 612 | — |
| Transceiver Channels | 48 | 8 |
| Maximum Transceiver Data Rate | 3.75 Gbps | — |
| PLLs | 8 (4 fractional, 4 general-purpose) | — |
| Process Node | 40 nm | — |
| Temperature na Operasyon | -40C to +85C (Industrial) | Commercial (0C to +85C) |
| Packhaging | 1152-FBGA (Flip-Chip BGA), 35x35 mm | 1152-ball FC-FBGA |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (SMT) |
| Tindminan RoHS | Lead Free (Compliant per data sheet) | [DATA_NEEDED: RoHS status] |
| Volte ng Pagbibigay | 0.9 V core (typical) | — |
| Speed Grade | C5 | -4 |
| Logic Elements (LE) | — | 244,188 |
| Embedded Memory Bits | — | 12,038,144 |
| Maximum User I/O | — | 612 |
| Transceiver Data Rate (max) | — | 5 Gbps |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Process Technology | — | 40 nm |
| Core Voltage | — | 0.9 V |
| Package Type | — | FBGA (Fine-pitch BGA, flip-chip) |
| Package Code | — | HBGA |
| Programmable Logic Device Type | — | FPGA |
| Hardened PCIe IP | — | PCI Express Gen2 x1/x4 |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |