EP2AGX45CU17I3G vs EP2AGX45DF25C4G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX45CU17I3G sa pamamagitan ng Intel at EP2AGX45DF25C4G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX45CU17I3G | EP2AGX45DF25C4G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GX | EP2AGX (Arria II GX) |
| Logic Elements | 42,959 | 45000 |
| Logic Array Blocks (LABs) | 1,805 | — |
| Total RAM Bits | 3,517,440 | — |
| User I/O Pins | 156 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Transceivers | Up to 8 channels | [DATA_NEEDED: transceiver count and data rate] |
| Transceiver Data Rate | Up to 3.125 Gbps | — |
| Process Technology | 40 nm | — |
| Core Voltage (Vcc) | 1.0 V (0.9 V internal) | — |
| PLLs | 4 | — |
| DSP Blocks | Yes (variable-precision DSP) | [DATA_NEEDED: DSP block count for EP2AGX45] |
| Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Packhaging | 358-ball UBGA (FCBGA), 17x17 mm | 572-BGA, FCBGA |
| Ball Pitch | 1.0 mm | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Level ng MSL | 3 (168 hours) | — |
| Tindminan RoHS | Compliant | — |
| Series | — | Arria II GX |
| Embedded Memory Bits | — | 3517440 |
| Adaptive Logic Modules | — | 42959 |
| Number of I/O | — | 252 |
| Package Code | — | DF25 (1.0 mm pitch) |
| Speed Grade | — | C4 (-4 speed grade) |
| Process Node | — | 40 nm |
| Lead Free / RoHS | — | Yes (suffix G = lead-free) |
| User I/O Banks | — | [DATA_NEEDED: number of I/O banks] |