EP2AGX45DF29I6N vs EP2AGX45DF29C5G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX45DF29I6N sa pamamagitan ng Intel at EP2AGX45DF29C5G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX45DF29I6N | EP2AGX45DF29C5G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | NRND |
| Device Family | Arria II GX | — |
| Device Sub-family | EP2AGX45 | — |
| Logic Elements | 42,960 | — |
| Embedded Memory | 1,728 Kbits (M9K + M144K) | — |
| User I/O Pins | 364 | — |
| Transceiver Channels | 8 (up to 6.375 Gbps) | 8 |
| Hard PCIe IP | PCIe Gen1/Gen2 x1/x4 endpoints | — |
| Hard Memory Controller | DDR3 (with soft PHY) | — |
| Packhaging | 780-ball FCBGA (FineLine BGA, DF29 pin-out) | 780-ball FC-FBGA (29 mm x 29 mm) |
| Speed Grade | 6 (fastest transceiver bin) | C5 |
| Temperature Grade | Industrial (-40C to +100C) | — |
| Process Node | 40 nm TSMC | 40 nm TSMC low-power |
| Logic Element Structure | 8-input ALM (Adaptive Logic Module) | — |
| Tindminan RoHS | Compliant | Compliant |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Family | — | Arria II GX |
| Logic Elements (LE) | — | 42,959 |
| Logic Array Blocks (LABs) | — | 1,805 |
| Embedded Memory Bits | — | 3,517,440 |
| User I/O Count | — | 364 |
| Max Transceiver Data Rate | — | 6.375 Gbps |
| Core Voltage (typ.) | — | 0.9 V |
| Temperature ng Junction na Operasyon | — | 0°C to 85°C (Commercial) |
| Lead Finish | — | Pb-free (G suffix) |
| Configuration Memory | — | SRAM-based (volatile) |
| Hard Memory Controllers | — | DDR3 / DDR2 / QDR II+ / QDR II |
| PCI Express Hard IP | — | Gen1/Gen2 (PIPE) |
| DSP 18x18 Multipliers | — | Up to 156 |
| PLLs | — | On-die (multiple) |