EP2AGX65DF25C6N vs EP2AGX65DF25I3G Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX65DF25C6N sa pamamagitan ng Intel at EP2AGX65DF25I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2AGX65DF25I3G - Arria II GX FPGA, 65K LE, 252 I/O, 572-FCBGA | Intel
EP2AGX65DF25I3G ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP2AGX65DF25C6N | EP2AGX65DF25I3G |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GX | Arria II GX |
| Logic Elements (LE) | 60214 | — |
| Logic Array Blocks (LABs) | 2530 | — |
| Embedded Memory (bits) | 5371904 | 5,371,904 |
| M9K Block Memory | 4.5 Mb | — |
| Distributed RAM | 1.4 Mb | — |
| Embedded 18x18 Multipliers | 12 | — |
| Fractional PLLs | 8 | — |
| Maximum User I/Os | 252 | — |
| Transceivers | Up to 12 channels, 3.75 Gbps | Up to 12 |
| PCI Express Hard IP | Gen1 x1/x4 | — |
| Process Technology | 40 nm CMOS, low power | 40 nm |
| Core Voltage (VCCINT) | 0.9 V | — |
| Packhaging | 572-ball FCBGA, 25 x 25 mm (DF25) | 572-ball FCBGA (Flip-Chip BGA) |
| Speed Grade | 6 (commercial, slow) | I3 |
| Temperature na Operasyon | 0 C to +85 C (commercial) | — |
| Tindminan RoHS | Lead-free, RoHS compliant | Compliant |
| Logic Elements | — | 60,214 |
| User I/O Count | — | 252 |
| Core Voltage | — | 0.9 V |
| Transceiver Data Rate | — | Up to 3.75 Gbps |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| DSP Blocks | — | Yes (embedded multipliers) |
| PCIe Hard IP | — | Yes (Gen1/Gen2) |
| Configuration Modes | — | AS, PS, FPP, JTAG |
| Uri ng Pagpapasok | — | Surface Mount |