EP2AGX65DF29C5G vs EP2AGX65DF29I3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX65DF29C5G sa pamamagitan ng Intel at EP2AGX65DF29I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2AGX65DF29C5G EP2AGX65DF29I3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo NRND
Family Arria II GX Intel FPGA (formerly Altera Arria II GX)
Logic Elements 60,214 —
Logic Array Blocks (LABs) 2,530 —
Total RAM Bits 5,371,904 5,371,904
User I/O Pins 364 —
Packhaging 780-ball FCBGA (FineLine BGA, 29 mm) 780-BBGA, FCBGA (FBGA-780, 29 x 29 mm, 1.0 mm pitch)
Process Technology 40 nm —
Core Voltage 0.9 V (0.87 V to 0.93 V) 0.9 V
Speed Grade C5 -3
Temperature Range (Junction) 0 °C to 85 °C (commercial) —
Maximum Internal Clock Frequency 500 MHz —
Transceivers Up to 12 (data rate up to 6.375 Gbps) Up to 8 multi-gigabit transceivers, up to 3.75 Gbps
Uri ng Pagpapasok Surface Mount (BGA) Surface Mount (BGA)
Level ng MSL [DATA_NEEDED: MSL rating] —
Tindminan RoHS Compliant Compliant (Pb-free N suffix)
Series — Arria II GX
Process Node — 40 nm TSMC low-power
Logic Elements (LE) — 60214
Number of LABs/CLBs — 2530
Embedded Memory (bits) — 5371904
User I/O Count — 364
Operating Frequency (max) — 500 MHz
Temperature na Operasyon — -40 C to +100 C (Industrial)
Configuration Method — JTAG, Active Serial, Passive Serial, Fast Passive Parallel

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