EP2AGX95EF35I3G vs EP2AGX95EF35C6N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGX95EF35I3G sa pamamagitan ng Intel at EP2AGX95EF35C6N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGX95EF35I3G | EP2AGX95EF35C6N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | NRND |
| Series | Arria II GX | — |
| Logic Elements | 89,178 | — |
| Total RAM Bits | 6,839,296 | — |
| Number of LABs/CLBs | 452 | — |
| User I/O Count | 452 | — |
| Packhaging | 1152-BBGA, FCBGA | 1152-ball FBGA (FineLine BGA), 35 mm |
| Uri ng Pagpapasok | Surface Mount | — |
| Temperature na Operasyon | -40C to +100C (Industrial) | Commercial (0C to +85C) |
| Volte ng Pagbibigay | 0.9 V core, 1.1 V/1.2 V/1.5 V/1.8 V/2.5 V/3.0 V I/O | — |
| Transceiver Count | Up to 12 channels | — |
| Max Transceiver Data Rate | 6.375 Gbps | — |
| DSP Blocks | 484 (18x18 multipliers) | — |
| Embedded Hard IP | PCI Express Gen1/Gen2 endpoint/root-port | — |
| Memory Interfaces | DDR3 SDRAM up to 800 Mbps, DDR2, QDR II+ | — |
| Process Technology | 40 nm TSMC | 40 nm TSMC |
| Tindminan RoHS | Compliant | Compliant |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Family | — | Arria II GX |
| Device | — | EP2AGX95 |
| Logic Elements (LE) | — | 89,178 |
| Logic Array Blocks (LABs) | — | 4,747 |
| Adaptive Logic Modules (ALMs) | — | 36,480 |
| Embedded Memory (Bits) | — | 6,839,296 |
| Embedded Multipliers (18x18) | — | 448 |
| User I/Os | — | 452 |
| Transceiver Channels | — | Up to 12 |
| Transceiver Data Rate (Max) | — | 6.375 Gbps |
| PCIe Hard IP | — | PCIe Gen2 x4 |
| Core Voltage | — | 0.9 V |
| Speed Grade | — | C6 |
| Memory Standards | — | DDR3 / DDR2 / LPDDR2 / QDRII+ |