EP2AGZ225FF35I3N vs EP2AGZ300FF35I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ225FF35I3N sa pamamagitan ng Intel at EP2AGZ300FF35I3N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ225FF35I3N | EP2AGZ300FF35I3N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Obsolete |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements (LE) | 224,000 | — |
| Embedded Memory | 14,248,960 bits (approx. 14.25 Mbit) | — |
| Logic Array Blocks (LABs) | 8,960 | — |
| User I/O Count | 554 | — |
| Maximum Transceiver Data Rate | 6.375 Gbps | — |
| Transceiver Channels | 24 | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V | 0.9 V |
| Temperature na Operasyon | -40C to +100C (Industrial) | — |
| Packhaging | 1152-ball FC-FBGA | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Level ng MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL rating] |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Configuration Method | SRAM-based (volatile, requires external config device) | — |
| Maximum User I/O | 554 | — |
| Logic Elements | — | 298000 |
| Number of LABs/CLBs | — | 11920 |
| Total RAM Bits | — | 18854912 |
| Number of I/O | — | 554 |
| Maximum Operating Frequency | — | 500 MHz |
| Package Type | — | 1152-BBGA, FCBGA (Flip-Chip) |
| Package Code | — | FF35 (35 mm body) |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |