EP2AGZ225HF40C3G vs EP2AGZ225HF40I3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ225HF40C3G sa pamamagitan ng Intel at EP2AGZ225HF40I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2AGZ225HF40C3G EP2AGZ225HF40I3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Arria II GZ Arria II GZ
Logic Elements 225,000 —
User I/O Count 734 —
Packhaging 1517-ball FBGA (HF40) —
Process Technology 40 nm 40 nm TSMC
Temperature na Operasyon Commercial (0C to +85C) -40C to +100C (industrial)
Speed Grade C3 I3 (industrial, -3)
Uri ng Pagpapasok Surface Mount Surface Mount
Volte ng Pagbibigay [DATA_NEEDED: core voltage] —
Embedded Memory [DATA_NEEDED: total Mbits] —
DSP Blocks [DATA_NEEDED: count and width] —
Transceivers [DATA_NEEDED: count and max data rate] —
PCIe Hard IP [DATA_NEEDED: PCIe Gen1/Gen2 lanes] PCIe Gen1/Gen2
Configuration Scheme [DATA_NEEDED: AS, PS, JTAG] —
Tindminan RoHS Compliant [DATA_NEEDED: RoHS status]
Level ng MSL [DATA_NEEDED: moisture sensitivity level] —
Lead-Free Yes —
Logic Elements (LE) — 224,000
Embedded Memory (bits) — 14,248,960
User I/O — 734
Logic Array Blocks (LABs) — 8,960
Embedded Multipliers (18x18) — 736
Transceiver Data Rate (max) — 6.375 Gbps
Package Type — 1517-BBGA, FCBGA (flip-chip BGA)
Configuration Memory — SRAM-based, volatile (requires external configuration device)
Supply Voltage (Core) — [DATA_NEEDED: core voltage]

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