EP2AGZ225HF40C3G vs EP2AGZ350HF40C3G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ225HF40C3G sa pamamagitan ng Intel at EP2AGZ350HF40C3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2AGZ225HF40C3G EP2AGZ350HF40C3G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Arria II GZ Arria II GZ
Logic Elements 225,000 —
User I/O Count 734 —
Packhaging 1517-ball FBGA (HF40) 1517-ball FineLine BGA (HF40)
Process Technology 40 nm —
Temperature na Operasyon Commercial (0C to +85C) Commercial (0C to 85C, suffix 0C)
Speed Grade C3 C3 (commercial, -3)
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Volte ng Pagbibigay [DATA_NEEDED: core voltage] —
Embedded Memory [DATA_NEEDED: total Mbits] [DATA_NEEDED: total embedded memory bits]
DSP Blocks [DATA_NEEDED: count and width] [DATA_NEEDED: DSP block count and 18x18 multiplier count]
Transceivers [DATA_NEEDED: count and max data rate] Up to 6.375 Gbps (channel count [DATA_NEEDED])
PCIe Hard IP [DATA_NEEDED: PCIe Gen1/Gen2 lanes] —
Configuration Scheme [DATA_NEEDED: AS, PS, JTAG] —
Tindminan RoHS Compliant Compliant
Level ng MSL [DATA_NEEDED: moisture sensitivity level] [DATA_NEEDED: MSL rating]
Lead-Free Yes Yes
Manufacturer — Intel (formerly Altera)
Logic Elements (LEs) — 350,000
User I/O Pins — 734
Package Pitch — 1.0 mm
Process Node — 40 nm
External Memory Interfaces — DDR3, DDR2, QDR II+ (up to 800 MHz)
PCI Express Hard Blocks — Yes (Gen1/Gen2)

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