EP2AGZ225HF40C4N vs EP2AGZ225FF35I4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ225HF40C4N sa pamamagitan ng Intel at EP2AGZ225FF35I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ225HF40C4N | EP2AGZ225FF35I4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 224,000 | — |
| Logic Array Blocks (LABs) | 8,960 | — |
| Adaptive Logic Modules (ALMs) | 89,600 | — |
| Embedded Memory Bits | 14,248,960 | — |
| User I/O Pins | 734 | — |
| Number of Package Pins | 1517 | — |
| Package Type | FBGA (FineLine BGA) | — |
| Package Code | HF40 | — |
| Operating Temperature Grade | Commercial (0C to +85C) | — |
| Temperature Range | -40C to +85C | — |
| Process Node | 40 nm | — |
| Transceiver Data Rate | Up to 6.375 Gbps | — |
| DSP Blocks | Yes (18x19 multiplier mode) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Lead Free / RoHS Status | Lead Free / RoHS Compliant | — |
| Logic Elements (LEs) | — | 224000 |
| Number of LABs/CLBs | — | 8960 |
| Total Memory Bits | — | 14248960 |
| Number of I/O | — | 554 |
| Supply Voltage - Core | — | 0.9 V |
| Process Technology | — | 40 nm |
| Maximum Operating Frequency | — | 500 MHz |
| Temperature na Operasyon | — | -40C to +100C (Industrial) |
| Packhaging / Kaso | — | 1152-BBGA, FCBGA |
| Package Dimensions | — | 35 mm x 35 mm |
| Lead Free / RoHS | — | Lead Free / RoHS Compliant |
| Level ng MSL | — | [DATA_NEEDED: MSL Level] |
| Temperature Grade | — | Industrial (I4) |