EP2AGZ300FF35C4N vs EP2AGZ225FF35C3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300FF35C4N sa pamamagitan ng Altera at EP2AGZ225FF35C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2AGZ300FF35C4N EP2AGZ225FF35C3N
Brand Altera Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete NRND
Series Arria II GZ —
Logic Elements 298,000 —
Logic Array Blocks (LABs) 11,920 —
Embedded Memory (bits) 18,854,912 (~17.9 Mbit) 14,248,960
User I/O Count 554 —
Number of I/O Banks [DATA_NEEDED: number of I/O banks] —
Process Technology 40 nm —
Core Voltage 0.9 V —
Package Type 1152-BBGA, FCBGA (flip-chip) —
Terminal Form Ball —
Package Code (JEDEC) HBGA —
Operating Temperature Grade Commercial (C4 = 0C to +85C) —
Configuration Memory SRAM-based (volatile, requires boot device) —
Transceivers Multi-gigabit transceivers integrated Up to 12.5 Gbps
DSP Blocks [DATA_NEEDED: number of DSP blocks] Yes (variable-precision)
PLLs [DATA_NEEDED: PLL count] —
Tindminan RoHS Compliant (per Besenchips / DigiKey listing) Compliant
Lead-Free Status Lead free (per Besenchips listing) —
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Maximum Operating Frequency 500 MHz —
Family — Arria II GZ
Logic Elements (LE) — 224,000
Logic Array Blocks (LAB) — 8,960
User I/Os — 554
Packhaging — 1152-BBGA, FCBGA
Process Node — 40 nm
Speed Grade — 3
Temperature Grade — Commercial (0C to +85C)
Memory Interfaces — DDR3, DDR2, QDRII+, RLDRAM2
PCI Express Hard IP — Gen1, Gen2

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