EP2AGZ300FF35I4 vs EP2AGZ300FF35I3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300FF35I4 sa pamamagitan ng Intel at EP2AGZ300FF35I3N sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ300FF35I4 | EP2AGZ300FF35I3N |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Family | Arria II GZ | Arria II GZ |
| Logic Elements | 298,000 | 298000 |
| Configurable Logic Blocks (LABs/CLBs) | 11,920 | — |
| Maximum User I/O | 554 | — |
| Operating Frequency (Max) | 500 MHz | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V | 0.9 V |
| Packhaging | 1152-ball FC-FBGA (FF35) | — |
| Temperature Grade | Industrial (-40 C to +100 C) | — |
| Number of Pins/Balls | 1152 | — |
| Terminal Form | Ball (BGA) | — |
| Transceivers | 12.5 Gbps integrated | — |
| Embedded Memory | M20K blocks (distributed) | — |
| DSP Blocks | Hard DSP columns (variable precision) | — |
| PCIe Support | PCIe Gen2 hard IP | — |
| Uri ng Pagpapasok | Surface Mount (flip-chip BGA) | Surface Mount |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS compliance status] |
| Lead-Free | Yes | [DATA_NEEDED: lead-free status] |
| Number of LABs/CLBs | — | 11920 |
| Total RAM Bits | — | 18854912 |
| Number of I/O | — | 554 |
| Maximum Operating Frequency | — | 500 MHz |
| Package Type | — | 1152-BBGA, FCBGA (Flip-Chip) |
| Package Code | — | FF35 (35 mm body) |
| Operating Temperature Grade | — | Industrial (-40C to +100C) |
| Level ng MSL | — | [DATA_NEEDED: MSL rating] |