EP2AGZ300FF35I4 vs EP2AGZ300FF35I4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300FF35I4 sa pamamagitan ng Intel at EP2AGZ300FF35I4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ300FF35I4 | EP2AGZ300FF35I4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Family | Arria II GZ | Field Programmable Gate Array (FPGA) |
| Logic Elements | 298,000 | 298,000 |
| Configurable Logic Blocks (LABs/CLBs) | 11,920 | — |
| Maximum User I/O | 554 | — |
| Operating Frequency (Max) | 500 MHz | — |
| Process Technology | 40 nm | 40 nm |
| Core Voltage | 0.9 V | — |
| Packhaging | 1152-ball FC-FBGA (FF35) | — |
| Temperature Grade | Industrial (-40 C to +100 C) | — |
| Number of Pins/Balls | 1152 | — |
| Terminal Form | Ball (BGA) | — |
| Transceivers | 12.5 Gbps integrated | — |
| Embedded Memory | M20K blocks (distributed) | — |
| DSP Blocks | Hard DSP columns (variable precision) | — |
| PCIe Support | PCIe Gen2 hard IP | — |
| Uri ng Pagpapasok | Surface Mount (flip-chip BGA) | Surface Mount |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | Yes |
| Series | — | Arria II GZ |
| Number of LABs/CLBs | — | 11,920 |
| Total RAM Bits | — | 18,854,912 bits |
| Number of I/O | — | 554 |
| Supply Voltage Core | — | 0.9 V |
| Temperature na Operasyon | — | -40C to +100C (Industrial) |
| Package Type | — | 1152-BBGA, FCBGA |
| Package Dimensions | — | 35 mm x 35 mm |
| Supplier Device Package | — | 1152-FBGA (35x35) |