EP2AGZ300FH29C4G vs EP2AGZ300FH29I3G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300FH29C4G sa pamamagitan ng Intel at EP2AGZ300FH29I3G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2AGZ300FH29C4G EP2AGZ300FH29I3G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Series Arria II GZ —
Logic Elements 300,000 (approx.) —
Number of LABs/CLBs [DATA_NEEDED: LAB count] —
Total RAM Bits [DATA_NEEDED: embedded memory bits] —
Number of I/O [DATA_NEEDED: max user I/O count] —
Number of Transceivers [DATA_NEEDED: transceiver count and rate] 24
Number of Multipliers (18x18) [DATA_NEEDED: DSP block count] —
Voltage - Supply [DATA_NEEDED: core and I/O supply rails] —
Temperature na Operasyon 0C to +85C (commercial grade, suffix C) —
Grade C4 (commercial, speed grade 4) —
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Packhaging / Kaso 780-BGA (Fine-pitch BGA, FH29) —
Level ng MSL [DATA_NEEDED: MSL moisture sensitivity level] —
Tindminan RoHS Compliant Compliant
Process Technology 40 nm —
Lead-Free Yes —
Manufacturer Intel (formerly Altera) —
Product Type — Field Programmable Gate Array (FPGA)
Family — Arria II GZ
Logic Elements (LE) — 300,000
Embedded Memory — 18,520 Kbits
DSP Blocks (18x18 multipliers) — 720
Maximum Transceiver Data Rate — 6.375 Gbps
Process Node — 40 nm TSMC
Packhaging — 780-pin FineLine BGA (FH29), 29x29 mm
Speed Grade — -3
Temperature Grade — Industrial (-40C to +100C)
Operating Voltage (Core) — 0.9 V
External Memory Interface — DDR3 up to 800 MHz

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita