EP2AGZ300FH29C4G vs EP2AGZ300FH29I4G Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ300FH29C4G sa pamamagitan ng Intel at EP2AGZ300FH29I4G sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2AGZ300FH29C4G EP2AGZ300FH29I4G
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Series Arria II GZ —
Logic Elements 300,000 (approx.) —
Number of LABs/CLBs [DATA_NEEDED: LAB count] —
Total RAM Bits [DATA_NEEDED: embedded memory bits] —
Number of I/O [DATA_NEEDED: max user I/O count] 281
Number of Transceivers [DATA_NEEDED: transceiver count and rate] —
Number of Multipliers (18x18) [DATA_NEEDED: DSP block count] —
Voltage - Supply [DATA_NEEDED: core and I/O supply rails] —
Temperature na Operasyon 0C to +85C (commercial grade, suffix C) —
Grade C4 (commercial, speed grade 4) —
Uri ng Pagpapasok Surface Mount Surface Mount (BGA)
Packhaging / Kaso 780-BGA (Fine-pitch BGA, FH29) —
Level ng MSL [DATA_NEEDED: MSL moisture sensitivity level] [DATA_NEEDED: MSL rating]
Tindminan RoHS Compliant Compliant
Process Technology 40 nm —
Lead-Free Yes Yes (per RoHS)
Manufacturer Intel (formerly Altera) —
Family — Arria II GZ (AGZ)
Logic Elements (LE) — 300,000 (approx., per family member)
Package Type — 780-ball Flip-Chip BGA (FineLine)
Package Code — FH29 (29x29 mm)
Hanay ng Temperature na Operasyon — -40C to +100C (industrial, I-grade)
Speed Grade — I4
Process Node — 40 nm TSMC
Supply Voltage (Core) — 0.9 V (typical)
Configuration Method — JTAG / Passive Serial / Fast Passive Parallel
Transceivers — Embedded multi-gigabit transceivers (per family)
DSP Blocks — Yes (variable-precision, per family)
Block RAM — Embedded M9K / M144K blocks

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