EP2AGZ350FH29C3G vs EP2AGZ300FH29C4N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ350FH29C3G sa pamamagitan ng Intel at EP2AGZ300FH29C4N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2AGZ350FH29C3G | EP2AGZ300FH29C4N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Aktibo | Aktibo |
| Logic Elements | 350,000 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | 119,200 |
| Embedded Memory (Bits) | 16,402,944 | — |
| Embedded Memory Blocks | [DATA_NEEDED: M9K/M144K block count] | — |
| User I/O Pins | 281 | 281 |
| Transceivers | 24 channels | Up to 28 (up to 6.375 Gbps) |
| Transceiver Data Rate (max) | 8.5 Gbps | — |
| PCI Express Hard IP | 4 x PCIe Gen2 (x1/x4) | — |
| External Memory Interface | DDR3 up to 800 MHz, DDR2, QDRII+ | — |
| PLLs | 8 (4 enhanced, 4 fast) | — |
| Global Clocks | 16 | — |
| Process Node | 40 nm TSMC | 40 nm |
| Speed Grade | C3 (commercial, slowest) | C4 |
| Temperature ng Junction na Operasyon | 0C to +85C | — |
| Packhaging | 780-ball FBGA (HBGA, 29x29 mm) | 780-ball FC-HFBGA (FH29) |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Tindminan RoHS | Compliant | Compliant |
| Lead-Free | Yes | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | — |
| Family | — | Arria II GZ |
| Logic Elements (LE) | — | 298,000 |
| Logic Array Blocks (LABs) | — | 11,920 |
| Embedded Memory (bits) | — | 18,854,912 |
| DSP Blocks | — | [DATA_NEEDED: exact DSP block count for EP2AGZ300] |
| Core Voltage | — | 0.9 V |
| Temperature Grade | — | Industrial (N suffix) |