EP2AGZ350HF40C4G vs EP2AGZ350HF40C3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ350HF40C4G sa pamamagitan ng Intel at EP2AGZ350HF40C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2AGZ350HF40C4G EP2AGZ350HF40C3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Aktibo Aktibo
Family Arria II GZ Arria II GZ
Logic Elements (LE) 350,000 —
Embedded Memory (bits) 20,480 Kbits —
User Accessible RAM (bits) 4.7 Mbits —
DSP Blocks 534 (18x18 multipliers) [DATA_NEEDED: DSP block count]
Transceivers [DATA_NEEDED: transceiver channel count for HF40 package] Up to 24 (per family datasheet)
Transceiver Data Rate up to 3.125 Gbps Up to 6.553 Gbps
PLLs 8 (fractional) —
Maximum User I/O 606 —
Hard Memory Controllers Yes (DDR3, DDR2, QDR) —
Hard PCIe Gen2 Endpoint Yes —
Process Node 40 nm —
Packhaging FBGA-1517 (HF40) 1517-ball FCBGA (HF40)
Pitch 1.0 mm —
Speed Grade 4 —
Temperature na Operasyon 0C to +85C (Commercial) —
Lead-Free / RoHS Lead-Free / RoHS Compliant —
Configuration Modes JTAG, Passive Serial, Fast Passive Parallel, Active Serial —
Logic Elements — 348,500
Adaptive Logic Modules (ALMs) — [DATA_NEEDED: ALM count]
Logic Array Blocks (LABs) — 13,940
Embedded Memory Bits — 21,270,528
Embedded Memory Blocks (M9K) — [DATA_NEEDED: M9K count]
User I/Os — 734
Core Voltage — 0.9 V
Process Technology — 40 nm low-power
Operating Temperature Grade — Commercial (C3)
Configuration Mode — FPP / AS / JTAG
Uri ng Pagpapasok — Surface Mount (flip-chip BGA)

Mga Datasheets at Resources

Tingnan ang Lahat ng mga Produkto Lumikha ng BOM Hilingin ang Kita