EP2AGZ350HF40I2N vs EP2AGZ350HF40I3N Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2AGZ350HF40I2N sa pamamagitan ng Intel at EP2AGZ350HF40I3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2AGZ350HF40I2N EP2AGZ350HF40I3N
Brand Intel Intel
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle NRND Aktibo
Family Arria II GZ Arria II GZ
Logic Elements 350000 —
Packhaging 1517-pin FBGA (HF40) 1517-ball FC-FBGA (HF40)
Temperature na Operasyon -40C to +100C (Industrial) —
Supply Voltage (Core) [DATA_NEEDED: core Vcc] —
Transceivers Embedded multi-gigabit transceivers —
Max Transceiver Data Rate 6.375 Gbps —
DSP Blocks [DATA_NEEDED: DSP block count] —
Embedded Memory [DATA_NEEDED: Mbits] —
User I/O Banks [DATA_NEEDED: bank count] —
Maximum User I/O [DATA_NEEDED: max user I/O count] —
Process Node [DATA_NEEDED: process node nm] —
Tindminan RoHS Compliant Compliant (lead-free N suffix)
Lead-Free Yes Yes
Uri ng Pagpapasok Surface Mount (BGA) —
Level ng MSL [DATA_NEEDED: MSL rating] —
AEC-Q100 not_applicable —
Series — Arria II
Logic Elements (LE) — 348500
Logic Array Blocks (LABs) — 13940
User I/O Count — 734
Total Embedded Memory Bits — 21270528
Process Technology — 40 nm
Core Voltage — 0.9 V
Operating Temperature Grade — Industrial (-40C to +100C)
Speed Grade — I3
Package Code — BGA (Ball Grid Array)
Terminal Form — Ball
Number of Terminals — 1517
Package Shape — Square

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