EP2C8AF256I8N vs EP2C5AF256I8N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2C8AF256I8N sa pamamagitan ng Intel at EP2C5AF256I8N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2C5AF256I8N - 4,608 LEs Cyclone II FPGA, 158 I/O, 256-FBGA | Intel
EP2C5AF256I8N ✓ NakahandaPagsanggunian na paghahambing
| Parametro | EP2C8AF256I8N | EP2C5AF256I8N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Aktibo |
| Presyo ng Yunit (USD) | $21.40 | — |
| Family | Cyclone II | Cyclone II |
| Logic Elements (LE) | 8,256 | — |
| Embedded Memory Bits | 165,888 bits (162 Kbit RAM) | — |
| Embedded Multipliers (18x18) | 36 | 13 |
| Maximum User I/O Pins | 182 | — |
| PLLs | 4 | 4 |
| Global Clocks | 16 | — |
| Configuration Elements | Embedded SRAM, JTAG, AS, PS | — |
| Core Voltage (VCCINT) | 1.2 V | — |
| I/O Voltage (VCCIO) | 1.5 V / 1.8 V / 2.5 V / 3.3 V (bank-selectable) | — |
| Process Technology | 90 nm CMOS, SRAM-based | 90 nm |
| Packhaging | 256-ball FBGA (FineLine BGA) | 256-LBGA (FBGA), 17 mm body |
| Temperature na Operasyon | -40C to +100C (Industrial, I suffix) | -40 °C to +85 °C (Industrial) |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | Lead-free (per Altera ordering code suffix) | Compliant (lead-free, 'N' suffix) |
| Speed Grade | 8 | 8 |
| Status Suffix | N (lead-free, Pb-free) | — |
| Logic Elements | — | 4,608 |
| Total RAM Bits | — | 119,808 |
| Number of I/O Pins | — | 158 |
| Number of Logic Units / LABs | — | [DATA_NEEDED: number of LABs] |
| Core Voltage | — | 1.2 V |
| Maximum Toggle Frequency | — | 402.5 MHz |
| Configuration Modes | — | Active Serial (AS), Passive Serial (PS), JTAG |
| DSP Performance | — | Up to approximately 25 GMACS |