EP2S130F1508C3 vs EP2S130F1508C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S130F1508C3 sa pamamagitan ng Intel at EP2S130F1508C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2S130F1508C3 | EP2S130F1508C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Obsolete |
| Family | Stratix II | Stratix II |
| Logic Elements | 132,540 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count] | [DATA_NEEDED: ALM count for EP2S130] |
| Embedded Memory (bits) | 6,747,840 | — |
| Maximum User I/O | 1,126 | — |
| Process Technology | 90 nm | — |
| Core Voltage (typical) | 1.2 V | — |
| Speed Grade | C3 (commercial) | C3 |
| Packhaging | 1508-ball FC-BGA | 1508-FCBGA |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to +85C (commercial) |
| DSP Blocks | [DATA_NEEDED: DSP block count] | — |
| Transceivers | [DATA_NEEDED: transceiver count/grade] | — |
| PLLs (Fast + Enhanced) | 8 + 4 (per family) | — |
| Configuration Modes | Passive Serial, Fast Passive Parallel, JTAG | — |
| Tindminan RoHS | Compliant | [DATA_NEEDED: RoHS status] |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount |
| Level ng MSL | [DATA_NEEDED: MSL level] | [DATA_NEEDED: MSL rating] |
| Device | — | EP2S130 |
| Logic Elements (LEs) | — | 132,540 |
| LABs/CLBs | — | 6,627 |
| Total RAM Bits | — | 6,747,840 |
| Embedded Memory | — | M4K + M-RAM blocks |
| Number of I/O | — | 1,126 |
| Number of Logic Elements/Cells | — | 132,540 |
| Voltage - Supply | — | [DATA_NEEDED: VCCINT/VCCIO/VCCA/VCCPD nominal values] |
| Process Node | — | 90 nm |
| Lead-Free | — | [DATA_NEEDED: lead-free status] |