EP2S130F1508C3N vs EP2S130F1508C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S130F1508C3N sa pamamagitan ng Intel at EP2S130F1508C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2S130F1508C3N | EP2S130F1508C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Family | Stratix II | Stratix II |
| Device | EP2S130 | — |
| Logic Elements (LEs) | 132,540 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count for EP2S130] | [DATA_NEEDED: ALM count] |
| LABs/CLBs | 6,627 | — |
| Total RAM Bits | 6,747,840 | — |
| Embedded Memory | M4K + M-RAM blocks | — |
| Number of I/O | 1,126 | — |
| Number of Logic Elements/Cells | 132,540 | — |
| Voltage - Supply | [DATA_NEEDED: VCCINT/VCCIO/VCCA/VCCPD nominal values] | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (BGA) |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to +85C (commercial) |
| Packhaging | 1508-FCBGA | 1508-ball FC-BGA |
| Speed Grade | C3 | C3 (commercial) |
| Process Node | 90 nm | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | — |
| Level ng MSL | [DATA_NEEDED: MSL rating] | [DATA_NEEDED: MSL level] |
| Logic Elements | — | 132,540 |
| Embedded Memory (bits) | — | 6,747,840 |
| Maximum User I/O | — | 1,126 |
| Process Technology | — | 90 nm |
| Core Voltage (typical) | — | 1.2 V |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| Transceivers | — | [DATA_NEEDED: transceiver count/grade] |
| PLLs (Fast + Enhanced) | — | 8 + 4 (per family) |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, JTAG |