EP2S130F1508C3N vs EP2S130F1508C5RB Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S130F1508C3N sa pamamagitan ng Intel at EP2S130F1508C5RB sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2S130F1508C3N | EP2S130F1508C5RB |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | NRND |
| Family | Stratix II | Stratix II |
| Device | EP2S130 | — |
| Logic Elements (LEs) | 132,540 | — |
| Adaptive Logic Modules (ALMs) | [DATA_NEEDED: ALM count for EP2S130] | — |
| LABs/CLBs | 6,627 | — |
| Total RAM Bits | 6,747,840 | — |
| Embedded Memory | M4K + M-RAM blocks | 6,747 Kbits (TriMatrix: MRAM/M4K/M512) |
| Number of I/O | 1,126 | — |
| Number of Logic Elements/Cells | 132,540 | — |
| Voltage - Supply | [DATA_NEEDED: VCCINT/VCCIO/VCCA/VCCPD nominal values] | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (FBGA) |
| Temperature na Operasyon | 0C to +85C (commercial) | 0C to +85C (commercial, junction) |
| Packhaging | 1508-FCBGA | 1508-ball FBGA (F1508), 40x40 mm, 1.5 mm pitch |
| Speed Grade | C3 | 5 (C5, commercial) |
| Process Node | 90 nm | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | Compliant |
| Lead-Free | [DATA_NEEDED: lead-free status] | Yes |
| Level ng MSL | [DATA_NEEDED: MSL rating] | 3 (per JEDEC J-STD-020) |
| Logic Elements | — | 132,600 |
| Logic Array Blocks (LABs) | — | 6,727 |
| User I/Os | — | 1,126 |
| Embedded 18x18 Multipliers | — | 252 (504 9x9 equivalent) |
| Process Technology | — | 90 nm CMOS |
| Core Voltage | — | 1.2 V (typical) |
| Lifecycle | — | Not Recommended for New Designs (NRND) |