EP2S130F1508C5N vs EP2S130F1508C3 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S130F1508C5N sa pamamagitan ng Intel at EP2S130F1508C3 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2S130F1508C5N | EP2S130F1508C3 |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Family | Stratix II | Stratix II |
| Logic Elements (LE) | 132,600 | — |
| Logic Array Blocks (LABs) | 6,627 | — |
| User I/Os | 1,126 | — |
| Packhaging | 1508-ball FC-FBGA | 1508-ball FC-BGA |
| Package Pin Count | 1508 | — |
| Operating Voltage (Core) | 1.2 V | — |
| Process Node | 90 nm | — |
| Speed Grade | -5 (C5) | C3 (commercial) |
| Temperature Grade | Commercial (0C to +85C) | — |
| On-chip RAM | [DATA_NEEDED: TriMatrix RAM bits] | — |
| DSP Blocks (18x18 multipliers) | [DATA_NEEDED: DSP block count] | — |
| Transceivers | Up to 12 channels (family maximum) | [DATA_NEEDED: transceiver count/grade] |
| Transceiver Data Rate (max) | Up to 6.375 Gbps (family spec) | — |
| Uri ng Pagpapasok | Surface Mount (BGA) | Surface Mount (BGA) |
| Tindminan RoHS | [DATA_NEEDED: per lot] | Compliant |
| Logic Elements | — | 132,540 |
| Adaptive Logic Modules (ALMs) | — | [DATA_NEEDED: ALM count] |
| Embedded Memory (bits) | — | 6,747,840 |
| Maximum User I/O | — | 1,126 |
| Process Technology | — | 90 nm |
| Core Voltage (typical) | — | 1.2 V |
| Temperature na Operasyon | — | 0C to +85C (commercial) |
| DSP Blocks | — | [DATA_NEEDED: DSP block count] |
| PLLs (Fast + Enhanced) | — | 8 + 4 (per family) |
| Configuration Modes | — | Passive Serial, Fast Passive Parallel, JTAG |
| Level ng MSL | — | [DATA_NEEDED: MSL level] |