EP2S130F1508I4TT vs EP2S130F1508C5 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S130F1508I4TT sa pamamagitan ng Intel at EP2S130F1508C5 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2S130F1508I4TT - 132K LE Stratix II FPGA, 1508-BGA | Intel
EP2S130F1508I4TT ⚠ Huling PagbiliAltera
EP2S130F1508C5 - Stratix II FPGA, 132K LEs, 1508-FBGA | Intel / Altera
EP2S130F1508C5 ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2S130F1508I4TT | EP2S130F1508C5 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Huling Pagbili | Huling Pagbili |
| Series | Stratix II | Stratix II |
| Logic Elements (LE) | 132,540 | — |
| Total RAM Bits | 6,747,840 (~6.4 Mbit) | — |
| User I/O Count | 1,126 | 1,126 |
| Packhaging | 1508-BBGA, FCBGA (FineLine BGA) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature na Operasyon | -40C to +100C (Industrial, speed grade -4) | Commercial (0 C to +85 C) |
| Process Node | 90 nm | — |
| DSP Blocks | Yes (dedicated 36x18 multipliers) | — |
| PLL Count | [DATA_NEEDED: PLL count] | — |
| Embedded Memory Type | TriMatrix (three block sizes per memory block) | — |
| Supply Voltage (Core) | [DATA_NEEDED: VCCINT] | — |
| I/O Standard Support | LVTTL, LVCMOS, LVDS, LVPECL, SSTL, HSTL (per family datasheet) | — |
| Speed Grade | -4 (mid-band) | C5 (commercial) |
| Temperature Grade | Industrial | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS status] | [DATA_NEEDED: RoHS compliance status] |
| Manufacturer | — | Intel / Altera |
| Logic Elements / Cells | — | 132,540 |
| Logic Array Blocks (LABs) | — | 6,627 |
| Number of CLBs | — | 53,016 |
| Embedded Memory (Bits) | — | 6,747,840 (approx. 6.7 Mbit) |
| Embedded 18x18 Multipliers | — | 252 |
| Core Voltage | — | 1.15 V to 1.25 V |
| Process Technology | — | 90 nm CMOS |
| Packhaging / Kaso | — | 1508-BBGA, FCBGA (FineLine BGA) |
| Package Dimensions | — | 40 x 40 mm |
| Ball Pitch | — | 1.0 mm |