EP2S130F780I4N vs EP2S130F780C4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S130F780I4N sa pamamagitan ng Intel at EP2S130F780C4 sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2S130F780I4N | EP2S130F780C4 |
|---|---|---|
| Brand | Intel | Altera |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Obsolete |
| Family | Stratix II | Stratix II |
| Logic Elements | 132,540 | 132,540 |
| Equivalent LEs (max) | Approx. 132,540 (density class up to 180k) | — |
| LABs/CLBs | 6,627 | — |
| Embedded Memory (bits) | 6,748,160 | — |
| Total RAM Bits | 6,748,160 | — |
| Maximum User I/Os | 534 | — |
| Number of Multipliers (18x18) | [DATA_NEEDED: multiplier count] | — |
| Number of PLLs | 16 | — |
| Process Technology | 90 nm CMOS (1.2 V, all-layer copper) | 90 nm CMOS |
| Core Voltage VCCINT | 1.2 V | — |
| I/O Voltage VCCIO | 1.2 V / 1.5 V / 1.8 V / 2.5 V / 3.3 V (multi-rail) | — |
| Maximum Internal Frequency | 711.24 MHz | — |
| Packhaging | 780-ball FC-FBGA (FineLine BGA), 29x29 mm, 1.0 mm pitch | 780-ball FC-FBGA (flip-chip) |
| Operating Temperature (Case) | -40C to +100C (Industrial, I4 suffix) | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Tindminan RoHS | Compliant (lead-free) | Lead-free (per datasheet) |
| Logic Array Blocks (LABs) | — | 6,627 |
| User I/O Pins | — | 534 |
| Internal Frequency (max) | — | 717 MHz |
| Core Voltage | — | 1.2 V |
| Package Code | — | F (FBGA-780) |
| Package Body Size | — | 40 x 40 mm |
| Ball Pitch | — | 1.0 mm |
| Speed Grade | — | C4 (commercial) |
| Terminal Form | — | Ball (BGA) |