EP2S60F1020I4 vs EP2S130F1020I4 Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2S60F1020I4 sa pamamagitan ng Altera at EP2S130F1020I4 sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Pagsanggunian na paghahambing
| Parametro | EP2S60F1020I4 | EP2S130F1020I4 |
|---|---|---|
| Brand | Altera | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | NRND | Obsolete |
| Manufacturer | Intel / Altera | — |
| Series | Stratix II | — |
| Logic Elements (LEs) | 60,440 | — |
| Embedded Memory (bits) | 2,544,192 | 6,747,840 |
| Number of LABs/CLBs | 3022 | — |
| Number of CLBs | 24176 | — |
| Maximum User I/O | 718 | — |
| Number of I/O Banks | [DATA_NEEDED: number of I/O banks] | — |
| Operating Voltage (Core) | 1.2 V | — |
| Process Technology | 90 nm CMOS | — |
| Temperature Grade | Industrial (-40C to +100C TJ) | — |
| Package Type | 1020-ball FC-FBGA (Fine-pitch Chip-Scale BGA) | — |
| Package Dimensions | 33 mm x 33 mm | — |
| Ball Pitch | 1.0 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount (FC-FBGA) |
| Configuration Method | Passive Serial / Fast Passive Parallel / JTAG | — |
| Number of PLLs | 12 | — |
| Global Clock Networks | 16 | — |
| Embedded Multipliers (18x18) | 36 | — |
| Transceiver Count | 0 (no embedded transceivers) | — |
| Maximum Embedded Memory Bandwidth | [DATA_NEEDED: memory bandwidth spec] | — |
| Tindminan RoHS | Non-compliant (contains lead per legacy Altera package) | Compliant (per distributor listings) |
| Family | — | Stratix II |
| Logic Elements | — | 132,540 |
| Equivalent LEs | — | ~180,000 |
| Adaptive Logic Modules (ALMs) | — | 53,016 |
| Embedded Memory (M512 blocks) | — | 530 |
| Embedded Memory (M4K blocks) | — | 768 |
| Embedded Memory (M-RAM blocks) | — | 4 |
| Embedded 18x18 Multipliers | — | 504 |
| DSP Blocks | — | 48 |
| User I/O Pins | — | 742 |
| User I/O Banks | — | 12 |
| Packhaging | — | 1020-ball FC-FBGA (33x33 mm) |
| Process Node | — | 90 nm CMOS, all-layer copper |
| Core Voltage (VCCINT) | — | 1.2 V |
| Speed Grade | — | I (industrial performance) |
| Device Revision | — | 4 |
| Temperature ng Junction na Operasyon | — | -40C to +100C (industrial) |
| Configuration Scheme | — | Fast Passive Parallel x8, Passive Serial, JTAG |