EP2SGX130GF1508C4 vs EP2SGX130GF1508C3N Ikinahambing
Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX130GF1508C4 sa pamamagitan ng Intel at EP2SGX130GF1508C3N sa pamamagitan ng Intel. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.
Intel
EP2SGX130GF1508C3N - Stratix II GX FPGA, 132K LEs, 20x Transceivers | Intel
EP2SGX130GF1508C3N ⚠ Huling PagbiliPagsanggunian na paghahambing
| Parametro | EP2SGX130GF1508C4 | EP2SGX130GF1508C3N |
|---|---|---|
| Brand | Intel | Intel |
| Kategorya | FPGA & CPLD | FPGA & CPLD |
| Katayuan ng Lifecycle | Obsolete | Huling Pagbili |
| Series | Stratix II GX | Stratix II GX |
| Logic Elements | 132,540 | 132,540 |
| Embedded Memory (Bits) | 6,748,160 | — |
| Logic Array Blocks (LABs) | 6,627 | 6,627 |
| Maximum User I/O | 734 | — |
| Internal Operating Frequency | 717 MHz | — |
| Number of PLLs | 4 | 12 |
| 18 x 18 Multipliers | 6,744 (approx, family feature) | — |
| Process Technology | 90 nm CMOS | 90 nm CMOS |
| Core Voltage | 1.15 V to 1.25 V (1.2 V nominal) | — |
| Package Type | 1508-Ball FC-FBGA | — |
| Package Dimensions | 40 mm x 40 mm | — |
| Ball Pitch | 1.0 mm | — |
| Uri ng Pagpapasok | Surface Mount | Surface Mount |
| Temperature ng Junction na Operasyon | 0 C to 85 C (commercial grade) | — |
| Logic Family | CMOS | — |
| Transceivers | Embedded multi-gigabit transceivers (Stratix II GX feature) | — |
| Tindminan RoHS | [DATA_NEEDED: RoHS compliance status] | Lead-free / RoHS Compliant |
| Family | — | FPGA - Field Programmable Gate Array |
| User I/Os | — | 734 |
| Total RAM Bits | — | 6,747,840 (approximately 6.75 Mbit) |
| Number of Transceivers | — | 20 |
| Transceiver Data Rate (max) | — | 6.375 Gbps |
| Number of 18x18 Multipliers | — | 56 |
| Internal Fabric Clock (max) | — | 717 MHz |
| Memory Clock (max) | — | 717 MHz |
| Core Supply Voltage | — | 1.15 V to 1.25 V |
| Operating Temperature Range (TJ) | — | 0 °C to 85 °C (commercial) |
| Packhaging | — | 1508-ball FBGA (FCBGA), 40 x 40 mm, 1.0 mm pitch |
| Estimated EOL Date | — | 2023 (per GlobalSpec listing) |