EP2SGX130GF1508C4 vs EP2SGX130GF40C3NES Ikinahambing

Detalyadong pagkakahiwalay na pagkakahambing ng EP2SGX130GF1508C4 sa pamamagitan ng Intel at EP2SGX130GF40C3NES sa pamamagitan ng Altera. Ikinahambing ang mga pangunahing paglalarawan, mga tama ng elektriko, paakay, kalagayan ng buhay, presyo, at pagkakaroon upang makita ang pinakamahusay na komponente para sa iyong mga kinakailangang pang disenyo.

Pagsanggunian na paghahambing

Parametro EP2SGX130GF1508C4 EP2SGX130GF40C3NES
Brand Intel Altera
Kategorya FPGA & CPLD FPGA & CPLD
Katayuan ng Lifecycle Obsolete Obsolete
Series Stratix II GX EP2SGX130
Logic Elements 132,540 132540
Embedded Memory (Bits) 6,748,160 —
Logic Array Blocks (LABs) 6,627 7047
Maximum User I/O 734 —
Internal Operating Frequency 717 MHz —
Number of PLLs 4 —
18 x 18 Multipliers 6,744 (approx, family feature) —
Process Technology 90 nm CMOS 90 nm CMOS
Core Voltage 1.15 V to 1.25 V (1.2 V nominal) 1.2 V
Package Type 1508-Ball FC-FBGA —
Package Dimensions 40 mm x 40 mm —
Ball Pitch 1.0 mm —
Uri ng Pagpapasok Surface Mount Surface Mount
Temperature ng Junction na Operasyon 0 C to 85 C (commercial grade) —
Logic Family CMOS —
Transceivers Embedded multi-gigabit transceivers (Stratix II GX feature) —
Tindminan RoHS [DATA_NEEDED: RoHS compliance status] Lead-free compliant (per package code MS-034AAU-1)
Family — Stratix II GX
Maximum Internal Frequency — 778.82 MHz
Transceiver Channels — 4 to 20 (per device family configuration)
Maximum Transceiver Data Rate — 6.375 Gbps
Transceiver Feature — Embedded SERDES with Clock/Data Recovery (CRU)
Uri ng Memory — TriMatrix embedded memory (distributed RAM, block RAM, shift register)
Packhaging — 1508-ball FC-FBGA (40 x 40 mm, 1 mm pitch)
Operating Temperature Grade — Commercial Extended
Terminal Form — Ball (BGA)

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